High-Throughput Substrate BGA Ball Mount Equipment
Substrate BGA Ball Mount
High-speed, high-precision solder ball placement for advanced BGA and flip-chip substrates.
Overview
The CosX Substrate BGA Ball Mount is engineered to meet the rising demand for precision and speed in semiconductor packaging. Designed for both substrates and singulated ICs, it delivers high-throughput solder ball mounting with micron-level accuracy.
Capable of placing over 80,000 solder balls in a single cycle, this equipment enables fabs and OSATs to achieve maximum productivity for high-volume BGA, CSP, and flip-chip packaging. An advanced 25MP CCD vision system ensures ±25 µm placement accuracy, while a robust warpage compensation system maintains stability even on bowed substrates up to 15 mm.
When integrated with CosX BGA Ball Repair, it becomes part of a closed-loop mount + repair workflow — reducing scrap, improving yield, and enabling sustainable advanced packaging.
Key Features
High Productivity Mounting
Places > 80,000 solder balls in a single cycle, enabling throughput up to 240 strips/hour.
Precision Placement Accuracy
±25 µm alignment powered by 25MP CCD vision inspection.
Versatile Substrate Handling
Supports substrates, carriers, and singulated ICs with edge clearance <0.1 mm.
Warped Substrate Compensation
Handles warpage up to 15 mm using a vacuum stage and precision press head.
Stable Ball Transfer with Fur Bin Box
Ensures consistent ball flow from template to substrate, minimizing loss.
Fast Jig Changeover
Tool-less jig replacement in < 30 minutes for maximum uptime
Inline BGA Ball Repair Integration
Works seamlessly with CosX BGA Ball Repair to create a closed-loop mount + repair workflow.
Pillar Mounting Capability
Supports pillar soldering beyond traditional ball placement, expanding process flexibility.
Technical Specification
Target Substrate Capability
Parameter
Specification
Support Substrate / Carrier Size
150 mm to 310mm (Length)
60 mm to 160mm (Width)
Singulated Type Size
≥ 10 mm to ≤ 80 mm
Max Boat
160 × 310 mm
Flux Application System
Parameter
Specification
Method
Pin Transfer
Positioning Accuracy
±10 µm
Ball Mounting
Parameter
Specification
Method
Fur Bin Box + Inclined Template + Vacuum Pick & Place
Ball Size Range
Ø0.125 – Ø0.76 mm
Ball Pitch Range
0.22 – 1.27 mm
Placement Accuracy
±10 µm
Balls per Cycle
≥ 80,000
Cycle Time / Productivity
Parameter
Specification
Cycle Time (Substrate)
15–18 sec per strip
Cycle Time (Single Unit)
25–28 sec per unit
Throughput (Strips)
200–240 strips/hour
Throughput (Boats)
128–144 boats/hour
Applications & Industries
- Flip-Chip Packaging: Reliable solder ball placement for fine-pitch ICs.
- Automotive Electronics: Ensures stable connections in mission-critical modules.
- HPC (High-Performance Computing): High-volume throughput for GPU and CPU substrates.
- Consumer Electronics: Efficient mounting for smartphones, tablets, and wearables.
- R&D / NPI: Scalable solution for pilot lines and process validation.
Competitive Advantages
- Throughput: > 80,000 balls per cycle vs ~60,000 industry average.
- Warpage Tolerance: Up to 15 mm vs typical 5–8 mm.
- Changeover Speed: < 30 minutes vs 1–2 hours for competitors.
- Repair Integration: Inline BGA Ball Repair capability creates a complete mount + repair workflow.
Integration with CosX Ecosystem
The Substrate BGA Ball Mount is designed to work seamlessly with CosX BGA Ball Repair, creating a closed-loop mount + repair workflow:
- Initial ball placement with Substrate BGA Ball Mount.
- Defect correction inline with BGA Ball Repair.
Frequently Asked Questions (FAQ)
Q1: What is the CosX Substrate BGA Ball Mount?
It is high-throughput solder ball placement equipment for substrates, carriers, and singulated ICs.
Q2: What is the maximum throughput?
Up to 240 strips/hour or 144 boats/hour, with >80,000 balls placed per cycle.
Q3: What ball sizes are supported?
Ø0.125 – Ø0.76 mm with pitch from 0.22 – 1.27 mm.
Q4: Can it handle warped substrates?
Yes. Warpage compensation supports up to 15 mm.
Q5: How fast is jig changeover?
Tool-less jig replacement is completed in <30 minutes.
Q6: Does it integrate with repair equipment?
Yes. It is designed for inline integration with CosX BGA Ball Repair, forming a complete mount + repair solution.
Ready to Scale Your Production?
CosX Substrate BGA Ball Mount has been deployed in Taiwan, Japan, Korea, China, Southeast Asia, Europe, and North America. Our global service network supports both high-volume fabs and R&D pilot lines.