High-Precision BGA Ball Repair & Rework Solutions
BGA Ball Repair
Micron-level precision for reworking missing, shifted, oversized, undersized, extra, and bridging solder balls.
Overview
The CosX BGA Ball Repair equipment addresses one of the most persistent challenges in semiconductor packaging: defective or missing solder balls. Instead of scrapping costly substrates, fabs can restore them to full functionality with micron-level accuracy.
With its 25MP optical inspection system and a ceramic pickup head with automatic alignment, the equipment identifies solder defects, replaces defective balls, and executes controlled reflow for reliable yield recovery. Whether deployed as a standalone rework station or inline module, CosX BGA Ball Repair helps fabs and OSATs improve yield, cut scrap costs, and extend substrate lifecycle.
Key Features
High Efficiency & Wide Defect Handling
Repairs missing, shifted, oversized, undersized, extra, and bridging solder balls
Micron-Level Capability
Supports ball sizes as small as 60 µm with a pitch down to 100 µm.
Versatile Mounting
Compatible with solder balls and pillars
Advanced Optical System
25MP CCD camera, high-speed processing, and proprietary defect detection algorithms.
Stable Output with Fur Bin Box
The Fur Bin system maintains stable ball transfer from template to substrate, minimizing ball loss and maintaining productivity.
Precision Ball Placement
Specialized ball container and ±15 µm placement accuracy with precision flux control.
Flexible Deployment
Operates as a standalone rework station or as part of an inline production system
Technical Specification
Target Substrate Capability
Parameter
Specification
Support Substrate / Carrier Size
150 mm to 310mm (Length)
60 mm to 160mm (Width)
Singulated Type Size
≥ 10 mm to ≤ 80 mm
Max Boat
160 × 310 mm
Thickness
0.1 to 5 mm
Flux Application System
Parameter
Specification
Method
Pin Transfer
Positioning Accuracy
±10 µm
BGA Ball Repair
Parameter
Specification
Pickup Head
Ceramic pickup head with automatic optical ball alignment and positioning correction
Supported Ball Size
Ø0.06 mm – Ø0.89 mm
Supported Ball Pitch
0.10 mm – 1.5 mm
Ball Placement Accuracy
±15 µm
Flux Dispensing Accuracy
±15 µm
Inspection Items
- Missing ball
- Shifted ball
- Extra ball
- Ball bridging
- Oversized ball
- Undersized ball
Image Processing System
- 25 MP high-speed CCD camera
- Resolution: 6–20 µm
- Field of view: 32 × 48 – 100 × 100 mm
Cycle Time / Productivity
Parameter
Specification
Inspection Rate
0.5 sec per FOV
Repair Speed
- < 3 sec Missing Ball Recovery Per Ball
- 5–8 sec Remove & Replace Per Ball
Recovery Yield
100% Based on ball count
Throughput (Boat)
128–144 boats/hour
Machine Dimensions & Utility
Parameter
Specification
Dimension (W x D X H)
2500 mm × 1800 mm × 1650 mm
Weight
Approx. 2,500 Kg
Power
3-phase 380V ±10%
CDA
5 kgf/cm²
Vacuum
750 mmHg
Applications & Industries
- Flip-Chip Packaging: Precision reballing for advanced ICs
- Automotive Electronics: Repair for safety-critical modules.
- High-Performance Computing (HPC): Yield recovery for GPUs, CPUs, AI accelerators.
- Consumer Electronics: Fine-pitch rework for smartphones, tablets, and wearables.
- R&D / NPI: Defect correction during prototype and new product validation.
Why Repair Instead of Scrap?
Scrapping a substrate for a handful of solder defects is costly. With CosX BGA Ball Repair:
- Recover yield instead of discarding.
- Reduce costs and waste with rework.
- Maximize ROI with up to 100% validated recovery.
- Extend substrate lifecycle with reliable micron-level reflow repair.
Integration with CosX Ecosystem
CosX BGA Ball Repair complements the Substrate BGA Ball Mount to create a closed-loop mount + repair workflow:
- Initial placement with the Ball Mount.
- Defect correction with BGA Ball Repair.
Frequently Asked Questions (FAQ)
Q1: What is BGA Ball Repair?
A high-precision rework process that restores defective solder balls on BGA and flip-chip substrates.
Q2: What solder ball sizes are supported?
Ø0.06 – Ø0.89 mm, with pitches 0.10 – 1.5 mm.
Q3: How fast is the process?
< 3 seconds per missing ball, 5–8 seconds for remove/replace.
Q4: What defect types can be repaired?
Missing, shifted, oversized, undersized, extra, and bridging solder balls.
Q5: Can it integrate into existing lines?
Yes. Available as standalone equipment or inline with SECS/GEM automation.
Q6: Does repair affect long-term reliability?
No. Repaired joints meet the same reliability standards as new solder placements.
Ready to Recover Your Yield?
CosX BGA Ball Repair has been deployed in Taiwan, Japan, Korea, China, Southeast Asia, Europe, and North America. Our global service network supports both high-volume fabs and R&D pilot lines.