EVENTS

Showcasing Innovation, Building Connections

At CosX Solution Co., Ltd., we actively participate in global trade shows, technical conferences, and industry exhibitions to share our latest innovations and strengthen partnerships. Our events highlight advancements in semiconductor equipment, SWIR vision systems, and automation solutions, while giving customers a firsthand look at our technologies in action.

Upcoming Events

SEMICON Taiwan 2025 Show:

Dates Sep. 10-12, 2025, TaiNEX 1&2, Taipei

  • September 10, Wednesday, 2025 | 10:00 am – 5:00 pm
  • September 11, Thursday, 2025 | 10:00 am – 5:00 pm
  • September 12, Friday, 2025 | 10:00 am – 4:00 pm

Event Highlights

BGA Ball Repair System, Mizar BA-1800R model, featuring enclosed repair modules and advanced vision control.

Substrate BGA Ball Mount

Engineered for high-volume lines, the Substrate BGA Ball Mount places solder balls at extreme speed with high positional control. ±25 μm alignment system, warped-substrate control, and rapid jig changeover deliver stable yield and uptime across product lines. Machine integration is supported.
  • 80K balls per cycle, ±25 μm placement
  • 25 MP alignment & inspection
  • Warped‑substrate control, fast changeover
View Product ❯
BGA Ball Repair System, Mizar BA-1800R model, featuring enclosed repair modules and advanced vision control.

BGA Ball Repair

Purpose-built for rework and recovery, this equipment detects and corrects missing, shifted, oversized/undersized, extra, and bridging balls. A 25 MP inspection engine and precision flux dispensing achieve ±15 μm placement accuracy. Operates standalone or inline.

  • Handles missing, shifted, oversized/undersized, extra, bridging
  • Min ball size 60 µm, min pitch 100 µm
  • 25 MP inspection, ±15 µm placement
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SWIR Vision System, SWIReR45 model, with integrated inspection unit and external control monitor.

SWIReR45 – SWIR Vision System

The SWIReR45 is CosX’s flagship SWIR vision platform, purpose-built for detecting internal cracks, sidewall chipping, and defects as small as 6 μm. Automated AI defect detection ensures reliability for next-gen advanced packaging.

  • Patented high-speed autofocus (< 50 ms)
  • Detection capability down to 6 μm
  • Large Field of View
  • Ultra-low overkill rate (< 1%)
Explore SWIReR45 ❯

Past Events

SEMICON Japan 2024

  • Date: December 11–13, 2024
  • Location: Tokyo Big Sight, Japan
  • Highlights: Showcased high-precision solder ball mounting and AI-driven defect inspection.

Why Our Events Matter

Our participation in industry events allows us to demonstrate cutting-edge technology in real-world applications, build strategic alliances with partners worldwide, gather customer feedback to guide future innovations, and contribute to discussions on industry trends and sustainability.

Meet us in the Event ❯