CosX Solution

Precision, innovation, and a global network delivering semiconductor equipment solutions and advanced packaging equipment

About CosX

CosX Solution Co., Ltd., headquartered in Taichung, Taiwan, is a leading provider of semiconductor equipment solutions and advanced packaging equipment with smart automation.

We develop high-precision, high-throughput systems that advance the future of packaging—from solder ball mounting and repair to die bonding and SWIR vision inspection.

Our mission is to deliver micron-level accuracy, scalable productivity, and Industry 4.0 connectivity so manufacturers achieve higher yields, lower cost, and sustainable growth.

Products & Solutions:

Corporate Commitments

CosX operates on integrity, innovation, and responsibility.

Join Our Journey

We build more than equipment—we help create an innovative and sustainable ecosystem for the semiconductor industry.
Careers ❯

Global Presence

CosX solutions are deployed across major semiconductor hubs in Taiwan, Japan, Korea, China, Southeast Asia, Europe, and North America. Our global service network supports both high-volume fabs and pilot lines.
See Events ❯
Contact Global Offices ❯