MCB-3000 Chip Bonder
High-Precision, High-Throughput Bonding for IGBT & Multi-Chip Applications
The MCB-3000 Multi-Purpose Chip Bonder is engineered for demanding semiconductor packaging applications, including IGBT, FRD, NTC, HPD, DSC, EASY, TPAK, and spacer bonding. Designed with flexibility in mind, it supports a variety of feeding methods and bonding techniques, ensuring optimal performance across diverse production environments.
With a customized gantry system, the MCB-3000 achieves exceptional throughput without compromising accuracy. Its high-precision alignment system, adaptive control features, and real-time process monitoring deliver consistent quality and repeatability for wafer, tray, and preformed solder ribbon bonding.
MCB-3000
Key Features
- Versatile bonding capability for multiple chip types and packaging formats
- Supports wafer, tray, preformed solder ribbon, tape & reel, vibrator feeder, and DBC carrier
- Wide die size compatibility: 0.3 mm to 16 mm (optional up to 0.1 x 0.1 mm)
- Handles wafer thickness from ≥40 µm (option up to 20 µm)
- High-precision placement: X, Y ≤ 10 µm; θ ≤ 0.05°
- Fast cycle time: 0.8–2.5 seconds per die (depending on conditions)
- Bonding force: 1–30 N (optional up to 100 N)
- Bond head heating up to 350°C
- Advanced automation with bond head auto-conversion
- SECS/GEM, OHT, AGV integration (optional)
Supported Inputs & Carriers
- Wafer Input: 6”, 8”, 12” (frame wafer / hoop ring)
- Tray Input: Wafer / JEDEC tray
- Preformed Solder Ribbon: Width 2–16 mm
- DBC Carrier: Pink standard carrier (max 330 x 460 mm)
- Tape & Reel: NTC T&R
- Other Inputs: Vibrator feeder
Advanced Capabilities
The MCB-3000 incorporates cutting-edge features to maximize productivity and yield:
- Real-time monitoring for process consistency
- Adaptive alignment control to handle substrate warpage and variations
- Automated feeder & carrier handling for reduced operator intervention
- Multi-language GUI with role-based process management and recipe setup
- Factory automation-ready for seamless integration into smart manufacturing lines
Applications
- IGBT module manufacturing
- High-power semiconductor packaging
- Multi-chip assemblies requiring high accuracy
- Substrate and wafer-level bonding with varying die sizes
MCB-3000 Technical Features
Die Size
0.3 mm – 16 mm (option: up to 0.1 x 0.1 mm)
Wafer Thickness
≥40 µm (option: ≥20 µm)
Accuracy
X, Y ≤ 10 µm; θ ≤ 0.05°
Cycle Time / Die
0.8 – 2.5 sec (condition-dependent)
Bonding Force
1–30 N (option up to 100 N)
Bond Head Heating
Up to 350°C
Wafer Input
6”, 8”, 12”
Tray Input
Wafer / JEDEC tray
Solder Ribbon Width
2–16 mm
DBC Carrier
Max 330 x 460 mm
Tape & Reel
NTC T&R
Other Input
Vibrator feeder