Research & Development

Turning Ideas into Industry-Leading Solutions

At CosX Solution Co., Ltd., research and development (R&D) is at the heart of everything we do. We invest heavily in precision mechanics, optical imaging, advanced packaging, and automation technologies to deliver the next generation of semiconductor equipment.

Our R&D teams in Taiwan, Japan, and Korea collaborate with academic institutes, semiconductor fabs, and industry partners worldwide to turn ideas into production-ready solutions.

Our Research & Development

Key Focus Areas

  1. SWIR Vision & AI Inspection
    • Developing advanced Shortwave Infrared imaging algorithms for defect detection and material analysis
    • Enhancing signal processing to improve accuracy and reduce inspection time
  2. Advanced Packaging Equipment
    • Solder Ball Mounting Systems: Optimizing precision and throughput while reducing material waste
    • BGA Ball Repair: Expanding defect handling capabilities with AI-assisted classification
  3. Power Device Die Bonding
    • Pioneering die attach technologies for IGBT, SiC, and GaN devices, enabling high-efficiency EVs, renewable energy, and HPC modules.
  4. Automation & Process Control
    • Integrating smart robotics and MES/SECS/GEM connectivity for real-time production management
    • Developing adaptive control systems to maintain performance under high-volume conditions

From Concept to Production

Conceptual Design

Aligning with market and customer needs

Prototyping & Testing

Rigorous functional and reliability validation

Pilot Production

Early-stage deployment with customer feedback

Full-Scale Manufacturing

Scaling with quality assurance at every step

Recent Breakthroughs

  • SWIReR45 SWIR Vision System – Industry-leading crack and defect detection.
  • MCB-3000 Chip Bonder – Micron-level bonding for IGBT, SiC, and GaN.
  • Fur Bin Transfer System – Stable ball transfer for >80K balls per cycle.
  • Adaptive Warpage Compensation – Up to 15 mm, ensuring high yield across substrates.

Global Collaboration

Our R&D is built on partnerships:

  • Joint research with universities and semiconductor institutes.
  • Pilot projects with leading global fabs.
  • Technology exchange with international automation partners.

Research Pipeline & Roadmap

Looking ahead, CosX is investing in:

  • FO-PLP and 3D packaging equipment
  • AI-enhanced inspection with predictive analytics
  • Eco-efficient designs to reduce power and chemical usage
  • Full automation ecosystems for end-to-end smart factories

Commitment to Innovation

At CosX, R&D is not just about products — it’s about shaping the future of semiconductor manufacturing. We combine scientific exploration, engineering excellence, and sustainable innovation to ensure our solutions create lasting impact.

Contact Our R&D Team ❯