CosX Solder Ball Mounting & BGA Ball Repair
SOLDER BALL MOUNT
Delivering micron-level accuracy and high throughput for advanced semiconductor packaging.
Substrate BGA Ball Mount
Over 80,000 solder balls per cycle with ±25 µm precision.
BGA Ball Repair
Intelligent defect detection and rework, restoring 100% yield.
Versatile & Scalable
Built for substrates, CSP, and flip-chip devices with Industry 4.0 integration.
SOLDER BALL MOUNT
At CosX Solution, Solder Ball Mounter and BGA Ball Repair are more than processes — they are critical enablers of next-generation semiconductor packaging. As device designs move toward finer pitches, higher density, and stricter reliability demands, ensuring solder ball placement accuracy and rework capability is essential to both yield and cost efficiency.
CosX has established itself as a trusted partner for fabs and OSATs worldwide by delivering a complete ecosystem that combines high-throughput substrate BGA ball mounting with micron-level BGA ball repair under one platform. This integration not only maximizes productivity but also ensures that packages with defects can be salvaged instead of scrapped, dramatically lowering the total cost of ownership.
Both mounting and repair solutions are designed for seamless Industry 4.0 integration. Features include SECS/GEM connectivity, OHT/AGV support, and inline ball recovery systems that reclaim unused balls for reuse. With tool-less jig conversions in under 30 minutes, fabs can rapidly adapt to new formats without extended downtime. By optimizing flux use and enabling ball recycling, CosX systems align with global sustainability goals while lowering operational expenses.
For fabs seeking higher yield, lower cost, and long-term scalability, CosX Solder Ball Mounter and BGA Ball Repair solutions stand as the trusted choice in advanced packaging.
Substrate BGA Ball Mount
CosX Solder Ball Mounters are designed for mass ball placement at scale without compromising accuracy. Using advanced optics and precision mechanics, our systems place more than 80,000 solder balls per cycle with micron-level alignment, supporting ultra-dense packages and warped substrate compensation.
Highlights:
- Throughput optimized for high-volume lines
- Placement accuracy down to ±25 µm
- Stable transfer with proprietary Fur Bin system
- Inline recovery to minimize material loss
- Rapid jig changeovers for flexible production
- Handles substrates warped up to 15 mm
- Pillar mounting capability for specialized applications
BGA Ball Repair System
Defective or missing solder balls pose a significant risk to yield and reliability. CosX BGA ball repair systems are purpose-built to detect and correct these issues with micron-level precision. Equipped with intelligent defect recognition, our systems identify missing, oversized, undersized, or misaligned balls. Using vacuum pick-and-place and precision reflow, they restore the package to 100% functionality with ±15 µm repair accuracy. This ensures that valuable substrates and devices are not scrapped due to minor defects, significantly lowering cost per unit and supporting sustainable manufacturing practices.
Highlights:
- Handles ball sizes as small as 60 µm
- Automated defect detection via 25MP optical system
- Recovery per missing ball in < 3 sec
- Standalone station or inline integration
Overview
Feature
Substrate BGA Ball Mount
BGA Ball Repair
Primary Function
High-throughput ball placement on substrates
Throughput
- > 80K balls per cycle,
- 200–240 strips/hour
- 100% recovery yield,
- < 3 sec per missing ball
Placement Accuracy
Supported Ball Sizes
Applications
Defect correction, reballing, yield recovery
Deployment
Standalone or inline rework station
Applications & Industries
CosX solder ball mount and repair solutions are deployed across diverse semiconductor sectors:
- Consumer Electronics – smartphones, tablets, and wearables
- High-Performance Computing (HPC) – servers, GPUs, and AI accelerators
- Automotive Electronics – safety, infotainment, and ADAS modules
- 5G & Networking – base stations, routers, and optical modules
- R&D and NPI Lines – prototyping and qualification of new packaging designs
Frequently Asked Questions
Q1: What is a Solder Ball Mounter?
A solder ball mounter is a precision system that places tens of thousands of solder balls with micron-level accuracy onto substrates, enabling BGA, CSP, and flip-chip packaging.
Q2: What is the difference between Solder Ball Mount and BGA Ball Repair?
Q3: What ball sizes are supported?
CosX Solder Ball Mount systems handle Ø0.125–0.76 mm, while the BGA Ball Repair system supports Ø0.06–0.89 mm, covering the full range of advanced packaging needs.
Q4: Can these systems integrate into Industry 4.0 lines?
Yes. Both systems support SECS/GEM connectivity, inline ball recovery, and OHT/AGV automation for smart factory environments.
Q5: How do these systems improve yield and cost efficiency?
By combining high-throughput mounting with micron-level repair, CosX solutions maximize usable output, reduce scrap, and lower cost per packaged device.