Die Bonder Solutions
Precision Assembly for IGBT, SiC, and GaN Power Modules
CosX provides a full suite of Die Bonder solutions for semiconductor packaging, with a strong focus on IGBT, SiC, and GaN power modules. Our systems cover the complete bonding process — from wafer and die handling to automated placement, pre-sintering, and inline integration — ensuring high yield, repeatability, and reliability in high-volume production.
With advanced automation features, micron-level accuracy, and flexible configurations, CosX die bonders deliver a competitive edge for manufacturers of power devices, automotive modules, and high-performance electronics.
Why Choose CosX Bonder Solutions?
- Precision Engineering: Micron-level accuracy for high-yield bonding
- Flexible Configurations – Available as standalone, inline, or fully integrated automation systems.
- High Productivity – Cycle times optimized for IGBT, SiC, and GaN packaging.
- Automation Ready – SECS/GEM, OHT, and AGV integration for smart manufacturing.
Our Bonder Product Range
MCB-3000 Multi-Purpose Chip Bonder
Application:
Designed for IGBT, FRD, NTC, HPD, DSC, EASY, TPAK, and multi-chip packages, the MCB-3000 is the backbone of our die attach portfolio.
Key Specifications:
- Die size: 0.3 mm – 16 mm (option: 0.1 × 0.1 mm)
- Wafer thickness: ≥40 µm (option: ≥20 µm)
- Accuracy: X, Y ≤ 10 µm; θ ≤ 0.05°
- Cycle time: 0.8 – 2.5 sec/die
- Bonding force: 1–30 N (option up to 100 N)
- Bond head heating: up to 350°C
Features:
- Supports wafer, tray, solder ribbon, tape & reel, DBC carrier
- Adaptive alignment and warpage handling
- Real-time process monitoring
- Automation-ready with SECS/GEM, OHT, AGV
Inline System for Automation
MCB-3000LF
Loader-Integrated Die Bonder
Designed for inline assembly lines, the MCB-3000LD integrates a high-speed carrier loader for seamless wafer and substrate handling. This configuration reduces manual intervention, improves takt time, and ensures smooth upstream workflow in high-volume production environments.
MCB-3000UD
Unloader-Integrated Die Bonder
The MCB-3000UD incorporates automated carrier unloading, optimizing downstream process flow. Ideal for fully automated lines, it ensures accurate die placement with consistent throughput, minimizing operator handling.
MCB-3000IL
Inline Bonding with Reflow Integration
Combines bonding and reflow in a continuous inline configuration. This reduces handling steps, shortens cycle times, and improves thermal bonding consistency — perfect for IGBT and high-power module assembly.
MCB-3000BU
Buffer Unit for Production Balancing
Maintains steady production flow by temporarily storing carriers between process stages. Prevents bottlenecks and downtime in automated lines, enabling synchronized operation across multiple bonder stations.
IGBT/SiC/GaN Power Module Product Line Integration
System configurations can be customized based on production capacity, footprint, and automation requirements.
Ag Sintering – AG-3000
High-Strength Silver Sintering
Uses advanced silver sintering technology for low-resistance, high-strength die attachment, ideal for high-power module applications.
Laser Mark – LM-200
High-Contrast Identification Marking
Applies unique identifiers to carriers and modules before bonding, enabling full traceability and process tracking throughout the manufacturing line.
DBC Module Test Automation – PAD-1000
Fully automated testing of DBC modules to verify electrical and thermal performance before assembly into final products.
Spacer & Component Mounting
Precision Component Integration
Installs spacers or other mechanical/electrical components to ensure proper module alignment, thermal management, and structural integrity.
Die Sorter – AP-800
Automated Die Sorting System
Classifies and sorts dies based on quality and specifications, ensuring only suitable dies proceed to bonding.
Final Test Automation – PAM-1000
End-of-Line Quality Assurance
Conducts final electrical and functional tests to ensure every assembled module meets performance standards.
Formic Acid Reflow – FAR-200
Oxide-Free Solder Reflow
Utilizes formic acid vapor to remove surface oxides during solder reflow, improving bond reliability.
Heat Sink Assembly Automation Line – MCB-3000IL
Integrated Heat Management Assembly
Attaches heat sinks with precision, ensuring optimal thermal performance of power modules.
KGD Handler – MCB-3000H
Pre-Tested Die Integration
Handles and bonds only verified Known Good Dies, reducing waste and improving yield.
Laser Drilling – LD-200
Precision Micro-Hole Processing
Creates fine holes in substrates or components for improved interconnection and thermal dissipation.
Pin Inserting – PS-100
Automated Pin Assembly
Reflow Automation – MCB-3000IL
High-Efficiency Inline Reflow
Wire Bond AOI – WBA-200
Automated Optical Inspection
Applications & Industries
CosX Die Bonders are deployed in:
- Automotive Power Modules – IGBT and SiC modules for EVs and ADAS.
- High-Power Electronics – Servers, data centers, and renewable energy devices.
- Consumer Devices – SiC/GaN integration for compact, high-efficiency electronics.
- R&D and NPI lines – Flexible systems for evaluation and pilot production.
Looking to enhance your die attach and bonding capabilities?
CosX provides proof-of-concept evaluations, system customization, and full automation consulting. Contact us today to explore how our Die Bonder solutions can accelerate your production.