CosX Semiconductor Technology

Technology Driving the Future

At CosX Solution Co., Ltd., technology is our foundation. Our high-precision semiconductor equipment powers the future of advanced packaging — from solder ball mounting and BGA repair to die bonding and SWIR vision inspection.

With micron-level accuracy, smart automation, and sustainable design, CosX helps manufacturers worldwide achieve higher yields, faster cycle times, and lower overall cost.

Our Core Technology Areas

Solder Ball Mounting & Repair

High-throughput solder ball mounters and BGA repair systems, built for high-density substrates

  • Substrate BGA ball mount: over 80K balls per cycle, ±25 µm accuracy
  • BGA repair: ±15 µm rework precision, restoring 100% yield
Explore Ball Mount Solutions ❯

Die Bonding (IGBT, SiC, GaN)

The MCB-3000 series delivers precision die bonding for multi-chip, power module, and wide bandgap devices

  • Supports IGBT, SiC, GaN
  • Built-in automation modules for loading/unloading, reflow, and buffering
Explore Die Bonding Solutions ❯

Vision Inspection Systems

CosX combines advanced optics with SWIR imaging to detect hidden defects in semiconductor devices

  • SWIReR45 SWIR Vision System: detects internal cracks, edge chipping, and defects as small as 6 µm
  • AI-driven defect classification, with seamless in-line integration
Explore Vision Systems ❯

Automation & Industry 4.0 Integration

Every CosX platform is designed for smart manufacturing lines

  • SECS/GEM connectivity
  • OHT & AGV support
  • Embedded process modules (loading, unloading, reflow)
  • Remote diagnostics and real-time monitoring

Sustainable Engineering

CosX integrates environmental performance into every system:

  • Reduced energy consumption
  • Material recovery (ball recycling, flux optimization)
  • Long-life design for extended equipment lifecycle
Learn About Sustainability ❯

Innovation in Action

Our technological breakthroughs include:

  • Fur Bin system for stable solder ball transfer
  • High-speed SWIR auto-focus imaging (<50 ms)
  • Micron-level die bonding for IGBT, SiC, GaN modules
  • Warpage compensation up to 15 mm

Every innovation reflects our commitment to engineering excellence and yield improvement.

Technology Roadmap

CosX R&D is focused on:

  • Next-generation packaging: FO-PLP, 3D integration
  • AI-enhanced inspection: smarter defect classification
  • Green manufacturing: reduced energy and chemical use
  • Automation ecosystems: expanding Industry 4.0 integration
Explore R&D ❯

Why Choose CosX Technology?

  • Proven precision in advanced packaging equipment
  • Scalable from pilot lines to high-volume fabs
  • Designed for flexibility, yield, and reliability
  • Backed by a global service and support network
Contact CosX Technology Experts ❯